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PUR Hot Melt
Application scope:
Weisbang 3542 is mainly used for bonding mobile phone frames and touch screens,
tablet computer frames and touch screens, window bonding, shell structure
bonding, battery bonding, touch screen assembly, keyboard bonding, flat
sealing, PCB assembly and protection, etc. Suitable for automatic heating and
dispensing systems, it provides sufficient assembly time, high initial
adhesion, and allows for preliminary treatment of the assembled parts. The
tough adhesive layer after curing provides excellent bonding strength and
impact resistance. It can be used as a single component, and subsequent
cross-linking and curing give polyurethane adhesive excellent body strength
characteristic:
Electronic reactive hot melt adhesive is a single component polyurethane
reactive hot melt adhesive that does not require heating and curing
Has high initial adhesion and is used in the rapid assembly industry.
Suitable for bonding between different substrates, including metal, glass, and
most plastics.
Short positioning time, strong and tough gel after curing, excellent high and
low temperature resistance.
Parameter performance:
Color: |
milky white |
Shear strength (24-hour curing PC-PC): |
1210~1750PSI |
Hardness Shore: |
52D |
Application temperature (rubber cylinder temperature setting): |
100-130°C |
Opening Hours: |
3 minutes |
Density: |
1.11 |
Solid content: |
100% |
Viscosity at 100 ° C: |
4400-7600 |
clean:
To remove the spilled adhesive, you can wait for the adhesive to cool to room temperature and use a putty knife to scrape off the sediment. Some uncured residues can be wiped off with ordinary solvents that dissolve polyurethane, such as toluene, butanone, etc. Please clean before the adhesive solidifies.
solidification:
In order to achieve complete curing, the composite product is expected to be stored at a suitable temperature and humidity (e.g. 25 ° C and 50% RH humidity, or above). If the thickness of the adhesive film is 0.5 millimeters or thinner, under suitable conditions, curing will be completed within 3 days. It takes a long time to achieve complete curing at lower temperatures and humidity. The curing rate and completion of curing will vary with the thickness of the adhesive film and the permeability of the substrate.
Storage:
This product should be stored in a cool and dry place, with an expiration date of 6 months. Reactive hot melt adhesive is packaged in sealed aluminum foil bags. If the packaging is damaged before use, please stop using immediately.
be careful:
The humidity in the air or humid environment will promote the curing of this adhesive. The cured adhesive will not melt and may cause damage to production equipment
Security protection:
When using this type of adhesive, it should be in a well ventilated area, and local exhaust ventilation equipment should be able to be installed in the adhesive application area and the heating pre melting area. (See MSDS of the product for details)
Packaging specifications:30ML/syringe