Application scope:
This product is widely used for solder joint protection, wire terminal reinforcement, etc


Product features:
1. This product has excellent adhesion and has good adhesion to glass, plastic, metal, circuit boards, etc.
2. It has thixotropy, making it easy to apply glue.
3. Enhance the bonding strength between solder joints and substrates.
4. It can be tested through strict high temperature and high humidity, high and low temperature tests, salt spray tests, etc; Excellent electrical performance.
5. Passed the EU RoHS standard.


Technical parameters:
Appearance: Light green liquid
Viscosity: 38000 (mPa. s) -46000 (mPa. s)
Hardness: Shore 7D
Curing energy 900mj-1200mj
Tensile strength:>30 (MPa)


usage method:
1. Clean the surface of the material;
2. Apply glue to the surface of the material using a glue dispenser or manually;
3. Illuminate with a UV lamp with a wavelength of 365 nanometers until the adhesive layer has fully cured;
4. After UV irradiation curing, if there is still glue overflow around, tools can be used to remove it;


matters needing attention:
1. Ensure that the adhesive layer absorbs sufficient ultraviolet energy to achieve optimal curing effect, otherwise it will affect the adhesive performance of the adhesive layer;
2. The remaining glue cannot be returned to its original packaging,
3. It should be stored at room temperature away from light and kept away from children.


term of validity:
Store at room temperature (10-25 ℃) under dark, sealed, and cool conditions, with a shelf life of 12 months
Packaging specification: 250ml/bottle 1000ml/bottle


Please consult Wisbon TDS for specific parameters